iPhone 18 Pro Teardown Uncovers a Hidden Face ID Camera and a Vapor Chamber Three Times Larger

REWA Technology posted one of the first teardown videos of the iPhone 18 Pro hours after the phone reached stores, working on the physical SIM version rather than the eSIM-only models sold in the United States and a few other markets. That choice matters because the SIM tray model carries a slightly smaller battery than the versions without a tray. The unit they opened weighs 209.3 grams and looks almost identical on the outside to last year’s phone, so older cases still snap on without trouble.

Lifting the display immediately reveals that the Dynamic Island appears thinner. Apple relocated the infrared camera for Face ID to the top left corner and then concealed it behind the display itself. To make this work, they had to design a specific pattern on the screen that allows infrared light to pass through without altering how it appears from regular viewing angles. Display makers that aren’t official Apple suppliers are now faced with a whole new set of challenges, since they will struggle to replicate those specific pixels and the relocated sensor. The display wire is held in place without glue, and many of the other flex cables within have become slightly broader and thicker since the previous edition.

Apple also chose to stretch the main rear camera and reroute its connection around the board. The new 48-megapixel Fusion camera has an adjustable aperture, and the infrared device is now further away, connected by three distinct cords rather than being bunched together like before. Some of these changes make it more difficult to make future swaps.

Further down the board, the A20 Pro chip is pressed up against the vapor chamber. It appears to be roughly three times the size of the one used in the iPhone 17 Pro, and has been measured as such. A novel material is employed as a thermal pad to fill the gap between the chip and the chamber. With the larger cooler and direct contact, heat should be able to be drawn away much faster, particularly during long video or gaming sessions. The NAND storage and power management chip are now sandwiched between layers of the board, making them much difficult to access if they fail. The metal shield that protected the logic EEPROM was removed, leaving it more exposed than previously. Wi-Fi and flashlight cords were also made longer.

When it comes to the battery, we’re looking at 4,056 mAh, which is a 1.7% increase over the previous Pro model. Apple claims that the new chip’s increased efficiency allows this phone to survive as long as last year’s Pro Max, although the difference in real-world tests has been very tiny thus far. The battery connector is now somewhat larger and uses a multi-layer flex cable from a new supplier, which is most likely why we’re seeing the higher charging speeds that Apple promised. Screen and battery replacements are still quite simple, but motherboard swaps are now likely the most difficult, with the back camera module trailing just slightly behind.